JPS5120251B2 - - Google Patents
Info
- Publication number
- JPS5120251B2 JPS5120251B2 JP12149272A JP12149272A JPS5120251B2 JP S5120251 B2 JPS5120251 B2 JP S5120251B2 JP 12149272 A JP12149272 A JP 12149272A JP 12149272 A JP12149272 A JP 12149272A JP S5120251 B2 JPS5120251 B2 JP S5120251B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Joining Of Glass To Other Materials (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12149272A JPS5120251B2 (en]) | 1972-12-06 | 1972-12-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12149272A JPS5120251B2 (en]) | 1972-12-06 | 1972-12-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4979469A JPS4979469A (en]) | 1974-07-31 |
| JPS5120251B2 true JPS5120251B2 (en]) | 1976-06-23 |
Family
ID=14812488
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12149272A Expired JPS5120251B2 (en]) | 1972-12-06 | 1972-12-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5120251B2 (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5378773A (en) * | 1976-12-23 | 1978-07-12 | Toshiba Corp | Preparation for semiconductor device of glass mold type |
-
1972
- 1972-12-06 JP JP12149272A patent/JPS5120251B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4979469A (en]) | 1974-07-31 |